System for testing integrated circuits

ABSTRACT

A system for testing integrated circuits by testing the change of integrated circuits under various temperatures comprises: at least one two-dimensional matrix testing module which includes a testing section having arrays for plugging integrated circuits to be tested, a heating section corresponding with the above testing section for heating integrated circuits respectively; a computer mainframe for connecting said two-dimensional matrix testing module and controlling the whole operations of the testing system, and a database. With the above-described structure, said database and said two-dimensional matrix testing module can be connected with the computer mainframe such that the temperature control information can be transmitted to provide each heater of said heating section to generate a suitable temperature, heat the integrated circuit to be tested, and store the test information.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a system for testing integratedcircuits, and particularly, to a test system with respect to a set ofintegrated circuits to be tested which are located at differentpositions in at least one two-dimensional matrix testing module,comprising heating the integrated circuits with various temperatures,respectively, to have the integrated circuits to be tested at differentpositions each reaching a different specific temperature, and thusachieving the object of shortening the total testing time horizon andsaving the total cost of testing through heating an individualintegrated circuit and heating stably.

2. Description of the Prior Art

It had been recognized that, since the working environment of anintegrated circuit most likely is much higher than room temperature, inorder to understand whether the characteristics of the integratedcircuit is changed under such a high temperature environment and itsoperating stability is further affected, a system for testing integratedcircuits can be used to have the integrated circuits reaching a specifictemperature and then carried out the testing.

Conventional systems for testing integrated circuits most likely canonly classify integrated circuits into various chambers in accordancewith the temperature to be tested and heat with hot air to a specifictemperature and carry out the testing.

However, the above-mentioned conventional systems for testing integratedcircuits have the following disadvantages in practice:

-   1. Each chamber can only heat a number of integrated circuits with    the same temperature simultaneously, and can not heat individual    integrated circuit according to its own requirement of the different    testing temperature respectively.-   2. Since distances of various integrated circuits from the air    outlet are different with respect to one another, the way of heating    with hot air in the chamber usually brings a situation of heating    unevenly and the accuracy and the quality of the testing are hence    affected severely.-   3. Each chamber can carry out only one testing temperature each    time, the testing time horizon will increase if there are many    temperatures to be tested.

In view of disadvantages in practice derived from the above conventionaltesting systems, the present inventor has accumulated a lot of personalpractical experience on the development business of related industry formany years and, after studying intensively, develops finally a systemfor testing integrated circuit.

SUMMARY OF THE INVENTION

Accordingly, the major object of the present invention is to provide asystem for testing integrated circuits, which can heat each integratedcircuit with respect to the individual testing temperature requirementand can heat stably, so as to achieve the aim of shortening the totaltesting time horizon and increasing the accuracy and the quality of thetesting, as well as saving the total cost of testing. In order toachieve the above object, the testing system according to the presentinvention comprises:

-   at least one two-dimensional matrix testing module, including: a    testing section that can provide arrays for plugging multiple    integrated circuits to be tested, a heating section corresponding to    the above testing section, wherein said array is provided with    multiple heaters in a manner that the integrated circuits can be    heated respectively;-   a computer mainframe, being used to connect the said two-dimensional    matrix testing modules and control the whole operations of said    testing system; and a database, being used to store temperature    control data by connecting said computer mainframe and said    two-dimensional matrix testing module, and to provide a suitable    temperature to every heater on said heating section for heating    integrated circuits to be tested and store up the test information;-   wherein, all heaters of said two-dimensional matrix testing module    are independent with one another, wherein the testing temperature of    each integrated circuit to be tested can be transmitted from said    computer mainframe to each heater of said two-dimensional matrix    testing module for execution, and, can transmit the test information    of each integrated circuit to said computer mainframe and saved into    said database.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings disclose an illustrative embodiment of the presentinvention which serves to exemplify the various advantages and objectshereof, and are as follows:

FIG. 1 is a schematic view of the system for testing integrated circuitsaccording to the invention;

FIG. 2 is a partial schematic view of the two-dimensional matrix testingmodule of the system for testing integrated circuits according to theinvention;

FIG. 3 is a three-dimensional view of the heater head according theinvention;

FIG. 4 is a exploded view of the heater head according to the invention;and

FIG. 5 is a flow chart of testing with the system for testing integratedcircuits according to the invention.

REPRESENTATIVE SYMBOLS OF MAIN COMPONENTS

1 two-dimensional matrix 2 testing section testing module 21semiconductor testing circuit 22 semiconductor test board 23 socket 3heating section 31 control circuit 32 substrate 33 heater 331 top seat332 socket unit 333 heating column 334 offseter 335 connection unit 336compressive spring 337 pressure gauge 338 heating circuit 339temperature sensing circuit 4 chamber 5 cooling unit 6 computermainframe 61 procedure controlling unit 62 temperature controlling unit63 signal output unit 64 measuring unit 7 database 8 PLR module 9integrated circuit

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In order to have the structure, the use and the characteristics of thesystem for testing integrated circuits according to the invention to befurther understood deeply, accurately and fully, the inventor presentspreferred embodiments and describes in conjunction with accompanyingdiagrams as follows:

First please referring to FIGS. 1 and 2, the system for testingintegrated circuits according to the present invention comprises:

-   a three-dimensional matrix, formed by six two-dimensional matrix    testing modules 1 in a manner that said six two-dimensional matrix    testing modules 1 can be installed in one chamber 4, said    two-dimensional matrix testing module 1 comprising:-   one testing section 2 which comprises a semiconductor circuit 21    provided on a semiconductor test board 22, and 8×8 sockets 23    provided on said semiconductor testing board 22 in a manner that    said integrated circuits 9 to be tested can be plugged therein    respectively, and that said multiple sockets 23 are connect to said    semiconductor testing circuit 21 respectively;-   one heating section 3, corresponding to said testing section 2, and    comprising a control circuit 31 on a substrate 32, and 8×8 heaters    33 provided in correspondence with said multiple sockets 23 on said    substrate 32 in a manner that said integrated circuits 9 can be    heated respectively, and that said multiple heaters 33 connect to    said control circuit 31, respectively;-   wherein said control circuit 31 can transmit the test information of    desired temperature of every said integrated circuit 9 to be tested    to the corresponding heater 33 for carrying out the heating, and    outputs the test information of said integrated circuits 9 via said    semiconductor test circuit 21.

The above-described heater 33, as shown in FIGS. 2 and 3, comprises:

-   a top seat 331, provided thereon with a socket unit 332 that can be    inserted in the substrate of said heating section 3 for positioning    said heater 33;-   a heating column 333, installed beneath said top seat 331, wherein a    offseter 334 is provided bulging form the bottom of said heating    column 333;-   a connection unit 335, being a multiple plug bar whose both ends    connect to said top seat 331 and said heating column 333    respectively, wherein a compressive spring 336 is provided around    said plug bar between said top seat 331 and said heating column 333;-   a pressure gauge 337, installed between said top seat 331 and said    heating column 333 and used to measure the pressure change as said    heating column 333 contacting said integrated circuit 9 to be    tested;-   a heating circuit 338, being provided by penetrating through said    heating column 333 for heating said heating column 333;-   a temperature sensing circuit 339, being provided by penetrating    through said heating column 333 to sense the temperature of said    offseter 334 at the bottom of said heating column 333;-   wherein, by contacting said offseter 334 to said integrated circuit    9, the integrated circuit 9 is heated up to a prescribed testing    temperature, and, when the temperature of said offseter 334 is    higher than the prescribed testing temperature of said integrated    circuit 9, the temperature sensing circuit 339 can sense the signal    and stop the heating of said heating circuit 338;-   a cooling unit 5, as shown in FIG. 1, being connected to said    chamber 4 for enabling said integrated circuits 9 in saud    two-dimensional matrix testing module 1 in the chamber 4 cooling    fast after the testing;

A computer mainframe 6, as shown in FIG. 1, for connecting saidtwo-dimensional matrix testing module 1 and controlling the wholeoperation of said testing system comprises:

-   a procedure controlling unit 61, for transmitting test data and    controlling the progress of the testing;-   a temperature controlling unit 62, which can input the temperature    control data of each integrated circuits 9 to be tested which    located at different position into each specific position of each    two-dimensional matrix module 1 for execution, respectively;-   a signal output unit 63, connected to each semiconductor testing    circuit 21 of the two-dimensional matrix testing module 1 for    detecting the pressure coefficient of each integrated circuit 9 in    said two-dimensional matrix testing module 1 and transmitting the    test information to said procedure controlling unit 61;-   a measuring unit 64, connected to each semiconductor testing circuit    21 in the two-dimensional matrix testing module 1, and transmitting    the test information of the characteristic change of each integrated    circuit 9 in each two-dimensional matrix testing module 1 under    various specific temperatures to said procedure controlling unit 61;-   a database 7, as shown in FIG. 1, connected to said two-dimensional    matrix testing module 1 via said computer mainframe 6 for storing    the temperature control data, using said procedure control unit 61    to read and then provide to each heater 33 on said heating section 3    the temperature control data in the database 7 for generating a    suitable temperature, heating the integrated circuit 9 to be tested,    and inputting the test information from each integrated circuit 9 to    said database 7 for storing said test information, wherein the test    information stored in the database 7 can be analyzed by a PLR module    8 and then return the analyzed data to said database 7. wherein each    said socket seat 23 of said two-dimensional matrix testing module 1    and each corresponding heater 33 are independent each other, and    wherein the related test temperature of each integrated circuit 9 to    be tested can transmit to each heater 33 for execution under the    control of said computer mainframe 6, and, the test information of    each integrated circuit 9 can be transmitted into the computer    mainframe 6 and stored in the database 7.

For carrying out a test with a testing system having the above-describedstructure, as shown in FIG. 1 and FIG. 5, integrated circuits 9 withvarious temperatures to be tested are placed in each socket in thetesting section of the two-dimensional matrix module 1. The temperaturecontrol data of each integrated circuit 9 is then input and stored inthe database 7. Each two-dimensional matrix testing module 1 is startedup by using the computer mainframe 6 to input the temperature controldata of the integrated circuits 9 set in the database 7 into each heater33. After using heater 33 to heat one to one, and controlling thetemperature of the integrated circuit 9 till each integrated circuit 9reach the temperature to be measured, measurements can be carried out.In the meantime, the measured data of each integrated circuit 9 aretransmitted to the database 7, where the measured data of eachintegrated circuit 9 are analyzed by using said PLR module 8 and theanalyzed data are then returned to the database 7 for storing.

As the testing completes, the integrated circuit 9 in thetwo-dimensional matrix testing module 1 of the chamber 4 can be cooledrapidly by using the cooling unit 5.

By the presentation of the above-described embodiment, it can be seenthat the present invention has following advantages:

-   1. Each integrated circuit 9 with various temperature environment to    be tested can be heated in the same time, thus the total time    horizon of testing can be shortened and the total cost of testing    can be reduced.-   2. As integrated circuit 9 is contacted with the heater 33 and can    be heated one to one, and the temperature of the integrated circuit    9 can be controlled and heated stably, the situation of heating    unevenly or over heated can never happen.-   3. As rapid cool is possible after testing, the total time horizon    of testing can be shorten, which is advantageous for carrying out    the subsequent testing. Many changes and modifications in said    described embodiment of the invention can, of course, be carried out    without departing from the scope thereof. Accordingly, to promote    the progress in science and the useful arts, the invention is    disclosed and is intended to be limited only by the scope of the    appended claims.

1. A system for testing integrated circuits by testing the change ofintegrated circuits under various temperatures, said system for testingintegrated circuits comprises: at least one two-dimensional matrixtesting modules, consisting of: a testing section, provided with arraysfor the insertion of multiple integrated circuits to be tested, aheating section corresponding with said testing section, wherein saidarrays are provided with multiple heaters in a manner that saidintegrated circuits can be heated respectively; a computer mainframe,for connecting said two-dimensional matrix testing module and hencecontrolling the whole operations of the testing system; and a database,connecting to said two-dimensional matrix testing module via saidcomputer mainframe for storing the temperature control data, providingeach of said heaters on said heating section for generating a suitabletemperature, heating the integrated circuit to be tested, and storingthe test information, wherein each of said heaters corresponding to eachsocket seat of said two-dimensional matrix testing module areindependent each other, and wherein the related test temperature of eachintegrated circuit to be tested can transmit to each heater forexecution under the control of said computer mainframe, and, the testinformation of each integrated circuit can be transmitted into thecomputer mainframe and stored in the database.
 2. A system for testingintegrated circuits according to claim 1, wherein said two-dimensionalmatrix testing module comprises: a testing section, comprising asemiconductor circuit provided on a semiconductor test board, andmultiple sockets provided on said semiconductor testing board, which canbe plugged with integrated circuits to be tested respectively, whereinsaid multiple sockets are connected to said semiconductor testingcircuit respectively; a heating section, provided corresponding to saidtesting section, and comprising a control circuit provided on saidsubstrate, and multiple heaters provided on said substrate correspondingto said multiple sockets, wherein said multiple heaters are connect tosaid control circuits, respectively; wherein, said control circuits cantransmit the test information of desired temperature of every integratedcircuit to be tested to the corresponding heater for execution, andoutput the test information of the integrated circuits from saidsemiconductor test circuit.
 3. A system for testing integrated circuitsaccording to claim 2, wherein said computer mainframe comprises: aprocedure controlling unit which can read the temperature control datain the database, and input the test information received from eachintegrated circuit into said database; a temperature controlling unitwhich can input the temperature control data of each integrated circuitsto be tested which located at different position into each specificposition of each two-dimensional matrix module for executionrespectively; a signal output unit which connects each semiconductortesting circuit of said two-dimensional matrix testing module, detectthe pressure coefficient of each integrated circuit in saidtwo-dimensional matrix testing module and transmits the test informationto said procedure controlling unit; and a measuring unit which connectsto each semiconductor testing circuit in said two-dimensional matrixtesting module, transmits the test information of the characteristicchange under various specific temperatures of each integrated circuit ineach two-dimensional matrix testing module to said procedure controllingunit.
 4. A system for testing integrated circuits according to claim 1,wherein said two-dimensional matrix testing module can be in multipleform and forms a three-dimension matrix.
 5. A system for testingintegrated circuits according to claim 1, wherein said at least onetwo-dimensional matrix testing modules can be installed into thechamber.
 6. A system for testing integrated circuits according to claim5, wherein said chamber is connected to a cooling unit which providesfast cooling of said integrated circuits in said two-dimensional matrixtesting module after testing.
 7. A system for testing integratedcircuits according to claim 1, wherein said test information stored inthe database can be analyzed by a PLR module and the analyzed data isthen returned to the database.
 8. A heater structure, plugged on asubstrate of a heating section of a two-dimensional matrix testingmodule for heating integrated circuits in the testing section, whichcomprises: a top seat, provided thereon a socket unit; a heating column,installed beneath said top seat, and provided with an offseter bulgedout the bottom of said heating column; a connection unit which connectsaid top seat and said heat column; a heating circuit, provided bypenetrating through said heating column and for heating the heatingcolumn; a temperature sensing circuit which penetrates through saidheating column to sense the temperature of the offseter at the bottom ofthe heating column; wherein, by contacting said offseter to saidintegrated circuit, the integrated circuit is heated up to a prescribedtesting temperature, and, when the temperature of the offseter is higherthan said prescribed testing temperature of said integrated circuit,said temperature sensing circuit can sense the signal and stop theheating of the heating circuit.
 9. A heater structure according to claim8, wherein said connection unit has multiple plug bars whose both endsconnect to said top seat and said heating column respectively.
 10. Aheater structure according to claim 9, wherein a flexible unit isfurther provided around said plug bar between said top seat and saidheating column.
 11. A heater structure according to claim 10, wherein apressure gauge is further installed between said top seat and saidheating column, which is used for measuring the pressure change aftersaid heating column contacting said integrated circuit to be tested. 12.A heater structure according to claim 10, wherein said flexible unit canbe a compressive spring.
 13. A heater structure according to claim 8,wherein said socket unit can be inserted on the substrate forpositioning said heater.